Medical	Medical
Analytical	Zeta Potential Particle Size Molecular Weight Capillary Electrophoresis Spherulite diam./Corr. Length
Spectrometry	Spectrometer Thickness Measurement Light Measurement FPD Evaluation Material Evaluation In-Process Evaluation

Medical

Medical
Analytical

Zeta Potential

Particle Size

Molecular Weight

Capillary Electrophoresis

Spherulite diam./Corr. Length
Spectrometry
Spectrometer

Thickness Measurement
- Thickness Monitor
- Thickness Monitor FE-300
- Spectrum Ellipsometer FE-5000/5000S
- Built-in film thickness monitor　FE-3
- Optical Thickness Meter OPTM series
- Line-Scan Thickness Monitor ™ (In-line type)
- Line-Scan Thickness Monitor ™ (Off-line type)
- Si Wafer Thickness Monitor
- Si Wafer Thickness Monitoring System　SF-3
Light Measurement

FPD Evaluation

Material Evaluation

In-Process Evaluation
- Wafer manufacturing process
- Array Spectrometer MCPD-9800
- FPD evaluation process
- LCD Cell Gap Measurement RETS series
- Built-in film thickness monitor　FE-3
- Color Filter Spectral Inspection System LCF series
- Retardation Film Inspection System　RETS-100nx
- LED evaluation process
- High-speed LED Spectrometer LE series
- Wafer manufacturing process
- Si Wafer Thickness Monitoring System　SF-3
- Built-in film thickness monitor　FE-3
- Film formation process
- Si Wafer Thickness Monitoring System　SF-3
- Built-in film thickness monitor　FE-3
- High speed retardation measurement system　RE-200
- Retardation Film Inspection System　RETS-100nx
List of Product
Discontinued Products

Si Wafer Thickness Monitoring System　SF-3

Real-time measurement of Si wafer thickness at CMP or BG

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Product
Specification
Configuration

Product

Feature

Non contact, non destructive measurement
Parameter setting after spectrum analysis
High speed real-time monitoring during CMP, BG
Measurement over interlayer such as protection film and window material
Multi layers analysis
Original analytical engine (Patent pending)
Original analytical algorism for thickness measurement (Patented)
Automatic mapping function for thickness distribution

Measurement item

Film thickness analysis (5 layers)

Application

Thickness measurement for Si wafer material
Grinding evaluation for silicon/ compound semiconductor
1.3mm/ next generation 450mm wafer
775㎛ 300mm wafer
TSV wafer (Si layer thickness measurement on via)
Other materials (SiO2, film)

Specification

Model	SF-3/200	SF-3/300	SF-3/1300
Silicon Measurement Thickness Range	6~400μm	10~775μm	50~1300μm
Resin Measurement Thickness Range	10~1000μm	20~1500μm	100~2600μm
Minimum Sampling Period	5kHz(200μsec)
Repeatability	less than ±0.01%^＊1
Measurement Size	Over about Φ20μm^＊2
Measurement Distance	50mm,80mm,120mm,150mm,200mm
Light source	Semiconductor light source (laser class 3B product)
Analysis Method	FFT analysis, optimization method^＊3
Interface	LAN, I/O input/output terminal
Power supply	DC 24 V specification, (AC power supply unit sold separately)
Size	W123×D224×H128mm
Optional Item	123（W）×224（D)×128（H）mm

＊1:The standard relative deviation of our standard sample AirGap
(approximately 300 μm and about 1000 μm) at time of measurement (n=20).
＊2:Design value at time of WD 50 mm probe specification
＊3:Used when measuring thinned wafers
＊CE acquired products are SF-3/300, SF-3/1300

Configuration

Product
Specification
Configuration

Si Wafer Thickness Monitoring System SF-3

Product

Specification

Configuration

Related Information

Si Wafer Thickness Monitoring System　SF-3